Principal R&D / Product DVL Engineer - High-Speed I/O Connectivity

Build the Future of AI Connectivity. Grow with a Team That Values Innovation, Collaboration, and Technical Excellence.

At TE Connectivity, every connection counts. Join a culture where world-class engineers collaborate across global teams to solve complex challenges, develop breakthrough technologies, and create products that power the world’s most advanced computing and networking systems.

TE Connectivity is expanding its Product Development Engineering team supporting our Harrisburg, PA engineering organization. We are seeking a highly experienced engineer to lead the development of next-generation High-Speed I/O (HSIO) copper connector solutions for AI, cloud, networking, and data center applications. This role will drive complex product development initiatives, influence technology roadmaps, mentor engineers, and strengthen the technical capabilities of our global organization.

Job Requirements

• Lead development of advanced HSIO connector products from concept through qualification and production launch.
• Develop product architectures, specifications, design objectives, and validation plans.
• Solve complex design, manufacturing, reliability, and customer application challenges.
• Drive innovation and technology differentiation in high-speed copper connector solutions.
• Collaborate with Product Management, Signal Integrity, Manufacturing, Product Assurance, and key customers.
• Mentor engineers and elevate organizational technical capabilities.
• Contribute to technology roadmaps, intellectual property, and strategic initiatives.

What your background should look like

• Bachelor’s degree in Mechanical Engineering with 12+ years of related experience; OR Master’s degree with 8+ years of related experience; OR PhD with 5+ years of related experience.
• CAD expert with extensive electromechanical product design experience (Creo is preferred).
• 12+ years of mechanical engineering experience developing electrical components, connectors, or related products.
• Advanced proficiency with FEA tools and simulation
• Strong GD&T, tolerance analysis, and specification-writing skills.
• Deep knowledge of machining, stamping, molding, plating, and assembly processes.
• Proven Design for Manufacturing (DFM) experience.
• Fluent English communication skills, written and verbal.
• Ability to work effectively across global teams and time zones.
• Strong analytical and problem-solving skills with limited supervision.

Nice to Have

• Knowledge and experience related to HSIO connectors.
• Understanding of high-speed electrical testing and connector performance.
• Green Belt or Black Belt certification.
• Executive-level presentation and customer communication skills.
• Thermal management and thermal simulation experience.
• Familiarity with optical interconnect technologies and system architectures.

COMPENSATION

• Competitive base salary commensurate with experience: $154,100 – $231,100 (subject to change dependent on physical location)
• Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
• Total Compensation = Base Salary + Incentive(s) + Benefits

Job Locations:

Posting City: #

Job Country: United States

Travel Required: Less than 10%

Requisition ID: 160252

Workplace Type: Remote

External Careers Page: Engineering & Technology