TPM (Advanced SoC Physical Design)

Job Title – TPM (Advanced SoC Physical Design)

Job Location – 100% Remote

Job Duration- 1+ year

Role Summary

·      The Technical Program Manager (TPM) – Advanced SoC Physical Design is responsible for leading end-to-end execution of complex SoC implementation programs from RTL handoff through GDSII signoff.

·      The role combines deep technical expertise in advanced-node Physical Design with strong program leadership, customer engagement, risk management, and cross-functional coordination across Design, Verification, DFT, Package, CAD, and Silicon Validation teams.

·      The TPM serves as the single point of accountability for delivery predictability, schedule adherence, quality, customer communication, and successful tape-out execution.

·      The ideal candidate possesses strong full-chip implementation experience across advanced process technologies and has demonstrated success driving large-scale ASIC/SoC programs to production.

Required

·      B.E./B.Tech/M.E./M.Tech in Electronics, Electrical Engineering, Computer Engineering, or related field.

·      12–18+ years of semiconductor industry experience.

·      Minimum 5+ years leading SoC implementation programs or full-chip tape-outs.

·      Proven experience managing customer-facing engagements and large delivery teams.

·      Track record of successful silicon tape-outs at advanced process nodes.

Preferred

·      Experience managing multi-site/global development teams.

·      Exposure to HPC, AI/ML, Data Center, Networking, Mobile, or Automotive SoCs.

·      PMP, PgMP, Agile, or equivalent program management certification.

·      Experience with AI-assisted design methodologies and EDA automation.